Princeton University
Micro/Nanofabrication Center (MNFC)
Princeton University
Micro/Nanofabrication Center(MNFC)
Princeton, New Jersey
The Micro / Nanofabrication Center (MNFC) has over 15,000 sq. ft. of ISO 5 – 6 cleanroom with over 75 tools to support researchers’ start-of-the-art fabrication needs. Contiguous with the main cleanroom is a 1,500 sq. ft. undergraduate teaching lab committed to educating and training. Part of the Princeton Materials Institute (PMI), adjacent core facilities include the Imaging & Analysis Center (IAC) and the Advanced MicroAssembly and Packaging (AMAP) labs. With a professional and experienced staff of 7 to support your fabrication needs, the MNFC is the preeminent cleanroom for researchers in Princeton University and external users from industry and academia in the New Jersey and Mid-Atlantic region.
The MNFC supports a full suite of lithography tools including two electron-beam lithography systems, direct-write and contact photolithography, 3D-printing, and all required support tools for creating patterns from the meso to the nanoscale. Further processing equipment includes a wide range of evaporators, sputtering systems, atomic-layer deposition (ALD), chemical vapor deposition (CVD), and RIE and ICP-RIE based etching systems for a variety of materials.
In addition to more typical electronic and quantum device development, the MNFC also supports fabrication in a variety of areas including advanced diamond etching, silicon and III-V processing, Micro Electro Mechanical Systems (MEMS), photonics, microfluidics, detectors for high-energy physics and cosmology, structures for analysis in chemistry and life sciences, and much more.
Adjacent PMI core facilities include the Imaging & Analysis Center (IAC) with world-class electron microscopy and advanced material analysis tools, as well as the Advanced MicroAssembly and Packaging (AMAP) labs, providing a full suite of tools for advanced device fabrication, packaging, and material analysis.
Facility at a Glance
Facility type: University cleanroom, Shared user facility
Facility mission: Academic research
Facility size: 15,000 sq.ft. and over 75 major fabrication tools
Cleanroom classification: ISO 5-7
Primary contact: Daniel Woodie, Director
Location: 86 Olden St., Princeton, NJ 08540
Institution website: https://www.princeton.edu/
Facility website: https://mnfc.princeton.edu/
Training program: https://mnfc.princeton.edu/how-become-user
Equipment and capabilities: https://mnfc.princeton.edu/tool-list
Core Capabilities
The MNFC has over 75 fabrication tools including electron-beam lithography, photolithography, thin film evaporation, sputtering, reactive ion etching, chemical vapor deposition, metrology, and a full packaging lab for your advanced fabrication and packaging needs.
Lithography
- Photolithography – Coat/Expose/Develop
- Maskless lithography / direct-write lithography
- Electron Beam Lithography
Etching and Material Removal
- Wet etching – KOH, BOE etc.
- Dry etching / RIE / ICP-RIE
- Deep reactive ion etching / DRIE
Featured Equipment
- Electron Beam Lithography (Raith EBPG 5150+) down to 10 nm
- Photolithography (Heidelberg DWL 66+) down to 600 nm
- Diamond processing / etching equipment for quantum and MEMS applications
- Thick Indium Evaporator for bump bonding / superconducting applications
- Soft Lithography Suite of tools for Microfluidics (PDMS)
- Advanced packaging facility focused on remote support for challenging packing needs
Packaging and Assembly
- Packaging and wire bonding
Thin Films and Thermal Processing
- Thin film deposition – Sputter/Evap
- Thin film deposition PECVD / ICP-CVD
- Thermal oxidation
Metrology and Electrical Characterization
- Metrology – Optical/SEM CD’s
- Metrology – Thin Film/Profilometry
- Electrical testing
- Contact Angle Measurement
- Thin Film Sheet Resistance
- Advanced SEM image analysis software (ProSEM)
Device Fabrication and Specialized Processing
- Microfluidics
- MEMS Sensor/Actuator fabrication
- Semiconductor device fabrication (Discretes)
- Quantum devices and diamond substrate processing
Materials and Applications
Materials Commonly Processed
- Silicon
- Silicon Dioxide
- Silicon Nitride
- Metals
- III-V materials
- Glass
- Polymers
- Photoresists, SU8 etc.
- Diamond
Devices and Application Areas
- MEMS Sensors
- MEMS Actuators
- Semiconductor discrete devices (diodes, solar cell, integrated circuits)
- Photonics / optoelectronics
- Microfluidics
- BioMEMS
- Quantum devices
- Power electronics
- RF / microwave devices
- Sensors and transducers
- Thin film devices
Metrology, Characterization, and Assembly
Metrology and Characterization
- Optical microscopy
- Profilometry
- Ellipsometry
- Film thickness measurement – Profilometry, Reflectometry
- SEM
- Electrical Probing
- I-V / C-V testing
- Sheet Resistance
Packaging and Assembly
- Dicing
- Wire Bonding
- Die Attach
- PCB integration
- Device Packaging
- Other
Education and Workforce Development
Training Offerings
- Cleanroom safety training
- Tool-specific training
- Other
Delivery formats: In-person, Online
Courses and programs: Single undergraduate course taught in dedicated instructional lab space
Approximate annual participation: 200
External or partner training: No
Opportunities for Collaboration
- Shared training materials
- Equipment best practices
- Safety procedures
- Industry engagement
- Workforce grant opportunities
- Outreach activities
Potential contribution to WaferWorkforce: We have an instructional lab that is very lightly used for undergraduate instruction that I would like to start running short courses in for both internal researchers as well as external attendees (external academic researchers, industry researchers, CC faculty, etc.)
Resources or connections sought: Process flows for short courses for devices beyond basic transistors / solar cells
Featured Expertise
Innovative ideas on facility management.
Accessing the Facility
Prospective collaborators should contact the facility directly to discuss access, training, visits, research, or workforce-development opportunities.
Contact:
Daniel Woodie
Director
Princeton University
Email: [email protected]
Phone: (607) 227-2993
