Washington Nanofabrication Facility

wnf logo transparent darick baker

University of Washington

Washington Nanofabrication Facility

Mason Road Seattle, WA

The Washington Nanofabrication Facility (WNF) is an open-access, nanofabrication facility at the University of Washington. Lab users have access to fabrication tools and expert staff. The WNF specializes in MEMS, optics, and photonics, but is equipped for most micro- and nanofabrication needs.

The Washington Nanofabrication Facility (WNF) consists of a 15,000-square-foot cleanroom space. The WNF focuses on MEMS, optics, and photonics and is available for academic and industrial use.

Facility at a Glance

  • Facility type: University cleanroom, Shared user facility, Research laboratory, Teaching laboratory, Workforce training facility
  • Facility mission: Education and training, Academic research, MEMS / microsystems development, Nanotechnology research
  • Facility size: About 13,000 square feet including bays and chases. Bays are ISO 5, 6, and 7. 8 bays: wet etch, lithography, metrology, PVD and plasma etch, CVD and dry etch, teaching lab, electroplating, and back end/assembly.
  • Cleanroom classification: ISO 5, ISO 6, ISO 7,
  • Primary contact: Darick Baker, Acting Director
  • Location: 115 Fluke Hall / 4000 Mason Road
    Seattle, WA 98195
  • Institution website: https://www.uw.edu/
  • Facility website: https://www.wnf.uw.edu/
  • Training program: https://www.wnf.uw.edu/education-outreach/
  • Equipment and capabilities: https://www.coral.uw.edu/tools/?lab=WNF
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Core Capabilities​

Lithography

  • Photolithography – Coat/Expose/Develop
  • Maskless lithography / direct-write lithography

Etching and Material Removal

  • Wet etching – KOH, BOE etc.
  • Vapor Etching – HF Vapor and/or XeF2 for example
  • Dry etching / RIE
  • Deep reactive ion etching / DRIE

Packaging and Assembly

  • Wafer bonding
  • Packaging and wire bonding

Featured Equipment

  • Microfluidics
  • MEMS Sensor/Actuator fabrication
  • Nanomaterials processing

Thin Films and Thermal Processing

  • Thin film deposition – Sputter/Evap
  • Thermal oxidation

Metrology and Electrical Characterization

  • Metrology – Optical/SEM CD’s
  • Metrology – Thin Film/Profilometry
  • Electrical testing

Device Fabrication and Specialized Processing

  • Microfluidics
  • MEMS Sensor/Actuator fabrication
  • Nanomaterials processing
materials processed

Materials and Applications

Materials Commonly Processed

  • Silicon
  • Silicon Dioxide
  • Silicon Nitride
  • Metals
  • Alloys
  • III-V materials
  • Glass
  • Polymers
  • Photoresists, SU8 etc.
  • Nanomaterials

Devices and Application Areas

  • MEMS Sensors
  • MEMS Actuators
  • Photonics / optoelectronics
  • Microfluidics
  • Quantum devices
  • Sensors and transducers
  • Thin film devices
  • Educational demonstration devices

Metrology, Characterization, and Assembly

Metrology and Characterization

  • Optical microscopy
  • Profilometry
  • Ellipsometry
  • Film thickness measurement – Profilometry, Reflectometry
  • SEM
  • AFM
  • Electrical Probing
  • I-V / C-V testing
  • Sheet Resistance
  • Surface analysis (EDX, for example)

Packaging and Assembly

  • Dicing
  • Wire Bonding
  • Probe Station Testing
assembly
education workforce

Education and Workforce Development

Training Offerings

  • Cleanroom safety training
  • Tool-specific training
  • Metrology training
  • Short courses / bootcamps

Delivery formats: In-person, Short course, Semester course, Summer program

Courses and programs: EE527, EE331, 1-week fabrication short course, equipment repair short course (in development)

Approximate annual participation: 16 year-around interns, ~36 people through short courses per year, ~80 new users per year, ~100 students in EE331 and EE527

External or partner training: Yes

Instructional Resources

We run a Schottky Diode project that is very sharable–process flows, mask layout, etc.

Opportunities for Collaboration

  • Shared training materials
  • Faculty professional development
  • Student exchanges or visits
  • Shared process flows
  • Equipment best practices
  • Safety procedures
  • Proposal development
  • Workforce grant opportunities
  • Conference presentations
  • Outreach activities

Potential contribution to WaferWorkforce: We have a bunch of interns that I can put on projects

Resources or connections sought: Professional connections for staff–opportunities to discuss problems; shared process flows and tool processes

instructional resources
accessing facilites

Accessing the Facility

External access or partner training status: Yes. Prospective collaborators should contact the facility directly to discuss access, training, visits, research, or workforce-development opportunities.

Contact:
Darick Baker
Acting Director
University of Washington
Email: [email protected]
Phone: 206-221-8265